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May 2, 2012

Yield Analysis Overview

Analysis of the device manufacturing process leads to process enhancements. Process enhancements lead to faster time-to-market and increased yields. Yield analysis technology includes:

  • Data mining and event-based analyses pinpoints patterns and trends using the ample data gathered throughout the process. This analysis helps determine where process variability is being introduced, allowing enhancements to be made and yields improved.
  • Defect data analysis identifies and locates the source of defects and other manufacturing process excursions. Defect impact to yield and the separation of random vs systematic yield loss directs the engineer to the critical issues allowing the team to focus and drive improvement faster.
  • Spatial pattern analysis (Defect and Sort) monitors the fab automatically for both known and unknown patterns, identifying process problems missed by in-line monitoring.