Software Support Login

Software releases, source codes, user guides. Customer password required.


Login now

MetaPULSE-IIIa System

Achieve high throughput and low cost-of-ownership for film thickness measurements in aluminum applications
Learn More

E30+B30 Module

High-throughput full edge and backside inspection of bare and product wafers with on-the-fly color image capture
Learn More

ProcessWORKS Software

Advanced Process Control Software
Learn More
02/21/2010

SPIE Advanced Lithography 2010

San Jose, CA
02/01/2010

Rudolph Technologies Fourth Quarter 2009 Financial Results Exceed Guidance; Record Bookings Lay Foundation For Robust 2010

01/19/2010

Rudolph Technologies Schedules 2009 Fourth Quarter Earnings Conference Call for February 1, 2010

01/11/2010

Rudolph Technologies Receives Multiple System Orders from STATS ChipPAC for eWLB Inspection

Thin, warped wafer handling using NSX 2D inspection system and WaferScanner™ 3D bump inspection system seen as key enabler for eWLB high-volume production
12/08/2009

Rudolph Announces Multiple Orders for Explorer Inspection Cluster from Taiwan Foundry

Automatic waferless recipe creation proves to provide added productivity for CMP inspection in a foundry environment