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January 12, 2016

New Technologies Will Fuel Pockets of Growth in 2016

Solid State Technology, January 2016

While the 2016 outlook for the semiconductor industry as a whole appears increasingly uncertain, there are areas where significant growth remains likely. In particular, advanced packaging, driven by growing consumer demand in applications ranging from smartphones and tablets to the Internet of Things (IoT), shows great promise for continued innovation.

First, we see outsourced assembly and test (OSAT) manufacturers driving the development of new packaging technology. For example, we’ve seen major gains in the adoption of fan-out packaging and copper pillar technology, evidenced by ongoing capacity expansion, and the addition of new players—the most obvious perhaps being the large ongoing investment by a leading foundry in Asia where our inspection equipment has received a prominent role. We see more and more manufacturers choosing to add yield management and/or advanced process control (APC) software, to obtain a competitive advantage in not only cost, but also reliability. This is achieved by transforming ultra-large data sets into useful information used for predictive analytics (reducing costs) and analysis across the supply chain (improving reliability).

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