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IEEE Electronic Components and Technology Conference

May 30 - June 2, 2017

Walt Disney World Swan & Dolphin Resort
Lake Buena Vista, FL USA

Heading to ECTC this spring? Stop by Rudolph booth #413 to speak with our experts about new advanced packaging inspection and metrology, lithography, and software solutions. Learn more about Rudolph’s product suite for the demanding requirements of the advanced packaging market, including 2D/3D bump inspection, RDL and overlay metrology, and a lithography stepper specifically designed for the back-end. Turn data into useful information with Rudolph’s proprietary software solutions including run-to-run control, fault detection and classification and yield management systems.