Product Overview
With a combination of inspection plus metrology, NSX 330 System measures multiple applications including wafer-level metrology for micro bumps, RDL, kerf, overlay, and through silicon via (TSV) in a single wafer load.
The NSX 330 System offers robust platform technology, including: high-acceleration staging, high-speed multi-processor computing and highly flexible software with an unprecedented level of usability. With over 1,000 NSX Systems installed worldwide, the NSX 330 System offers increased 2D inspection and metrology throughput and a broad portfolio of 3D sensors supporting critical advanced packaging applications.
Applications
- WLCSP
- RF/MEMS
- Simultaneous high accuracy topography, depth and thickness measurements
- Substrate thickness, TTV, and bonded wafer thickness stack thickness (carrier, adhesive, product wafer and total stack)
- Via depth (unlimited aspect ratio)
- Thick and thin RST
- Bow and warp
Specifications
- Choice of inspection platforms with hard-anodized finish which can accommodate 100mm to 330mm whole wafers
- The objective turret provides flexibility for inspection applications requiring both high throughput and high resolution. The turret assembly has five (5) available slots and can be populated with any combination of 1X, 2X, 3X, 5X, 10X , 20X and 50x objectives.
- Programmable light tower
- Programmable illumination filter wheel
- Multiple modes of dark field illumination
- Standard docking module
- Resolution flexibility (10µm to 0.5µm)
- Three simultaneous color defect review methods: on-the-fly, high resolution, whole wafer
- Teams with edge and backside modules for all-surface solution
- Unique handling solutions (Mems, Taiko, Thin), extreme warpage (>12mm) and ultra-thin (<50µm)
- Tool matching
- Recipe sharing
- Recipe server
- Discover® Software database results archiving
- Offline inspection and metrology engineering clients
- Offline defect review clients