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Discover® is an inline defect analysis and data management system designed to seamlessly handle advanced macro frontside, edge and backside inspection results.

With built-in wafer level ADC, Discover enables quick identification of damaging killer defects that can ruin the entire wafer. Device failure can now be correlated to backside and edge defects in a single intuitive screen. Designed with process excursion detection ability, Discover can automatically issue alarms and trigger user-defined macros that reproduce skilled decision-making steps. Creating, deploying and managing all-surface wafer inspection sampling plans have never been easier. Discover is the perfect solution for your all-surface analysis needs.

Discover is designed with:

  • Customizable reports
  • Built in spatial pattern recognition
  • Advanced sampling to improve the performance of your ADC system
  • Ability to pass or fail wafers based on customizable logic
  • Automated alarms
  • In depth analysis tools to satisfy even the most detailed engineers

June 28, 2016

Rudolph Receives Multi-System Order for Over $11 Million From a Leading OSAT for Fan-out Wafer Level Packing Inspection

April 7, 2016

Rudolph Adds High-speed 3D Metrology to the NSX Series for Advanced Packaging Process Control

June 22, 2015

Bosch Selects Rudolph for Dynamic Semiconductor Inspection Solutions

August 11, 2014

Rudolph Receives Purchase Order from Major Taiwan OSAT for 2D/3D Inspection Systems

February 11, 2013

Rudolph’s Discover Yield Management Software Gains Traction in Advanced Packaging Applications

October 3, 2011

Rudolph Fulfills Multiple System Orders for TSV Inspection and Metrology

January 11, 2011

Rudolph Technologies Receives Multiple Back-end Orders from Major European Semiconductor Manufacturer

November 30, 2010

Rudolph Technologies Collaborates with Asia OSAT on Development and Characterization of Stacked Packaging Process

November 9, 2009

Rudolph’s Automated Data Analysis Software Improves Yield in MEMS Inspection

October 8, 2009

Rudolph Technologies Receives Multiple System Order from ASE for its Complete Portfolio of Back-end Inspection Solutions

September 29, 2009

Rudolph Technologies Releases Fast Review and Die Sort Classification Software for Back-end Manufacturing

June 15, 2009

Rudolph Announces All Surface Front-end Inspection Sale to Memory Manufacturer

December 2, 2008

Rudolph’s New Explorer Macro Defect Inspection System Gains Traction with Low Cost-of-Ownership

April 15, 2008

Rudolph Announces Installation of Multiple NSX Tools at WIN Semiconductors’ GaAs Foundry