JetStep W Series

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JetStep W Series

State of the art 2x reduction stepper with large field of view for wafers or round substrates

Rudolph’s JetStep® W Series is designed and engineered for the most challenging advanced packaging applications. As resolution, overlay and many more technical specifications become tighter and more sophisticated for advanced packaging processes, fulfilling lithography requirements becomes a challenge. Rudolph's JetStep W System has been specifically designed to meet these challenges head on. With specialized optics and key system advantages, the JetStep system has been engineered to maximize throughput without limiting resolution and overlay. 

 

Designed for Advanced Packaging Applications:
WLCSP                    Solder Bump                   Gold Bump
Cu Pillar Bump      RDL/UBM                         eWLB/Fan-out
TSV                          Interposers                      Non-standard substrates

 

JetStep System
  • Large field of view – fewer exposure shots per wafer
  • 30 reticle library – increased throughput, lower reticle change-out time
  • 4 reticle wheel – increased throughput, lower reticle change-out time
  • 17mm working distance – top of the substrate to bottom of the lens – less outgassing effect and fewer PM’s
  • Single-sided telecentric lens – allows for automatic magnification compensation
  • On the fly autofocus – exact focus on every exposure shot
  • 2X reduction stepper – larger field of view, better reticle designs
  • 2µm resolution, 0.5um overlay – for state of the art Advanced Packaging requirements
  • Programmable aperture blades – higher throughput, improved use of reticles
  • Handling: expose all wafer sizes – 300mm, 300mm ++, 450mm
  • Handling: expose all substrate types – silicon, re-constituted wafers, glass
  • Handling: round wafers and substrates
  • Handling: expose highly warped wafers
  • Closed loop process control – real time recipe adjustments for improved overlay
  • Superior depth of focus – exposure through thick photoresists