May 2, 2012
Through Silicon Via (TSV)
A through-silicon via 3D package (3D IC) contains two or more chips stacked vertically, with vias through the silicon substrates replacing edge wiring to create an electrical connection between the circuit elements on each chip. TSV technology provides a dramatic increase in the functionality of the device in a very small footprint. Multiple technologies are being explored to form vias during the wafer fabrication process (front-end) and the IC packaging and assembly stage (back-end). Metrology and inspection of the TSVs are critical for ensuring the performance of the 3D ICs and the profitability of the overall manufacturing process.