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October 16, 2013



The trend towards 3D stacking and Advanced Packaging has significantly altered the requirements for manufacturing tools in the back-end. Techniques and processes being adopted are beginning to resemble the front-end of 20 years ago but with updated and more affordable cost-of-ownership capabilities. As an example, 0.5μm defect inspection would have been considered a front-end requirement 20 years ago. Today TSV and Advanced Packaging techniques such as fine-pitch RDL are demanding 0.5μ level inspection but at 10x improvement in wafer throughput and 20x improvement in COO. Other front-end capabilities ranging from metrology to Advanced Process Control (APC) that are being adopted by the back-end will also be discussed.

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