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January 13, 2015

2015 Advanced Packaging Viewpoint

Semiconductor Packaging News, January 2015

"With new technologies like Cu Pillar becoming an integral part of emerging electronic products, 2015 promises to be an exciting year for the packaging industry.

To provide differentiated value to customers in the advanced packaging ecosystem, Rudolph Technologies plans to leverage its unique, leading-edge hardware and software platforms. These solutions provide exceptional value, and when combined, allow customers to solve even the most complex manufacturing challenges."

-Thomas Sonderman, Vice President and General Manager, Software Business Unit