Intelligent, adaptive wafer scheduling, flexible inspection configurations and multiple loadport options
As the illumination industry transitions from incandescent illumination to more power-efficient Light Emitting Diodes (LED), manufactures must aggressively reduce product cost and increase wavelength consistency and quality to capture market share
Advanced manufacturing control techniques (inline defect inspection, automatic defect classification, source analysis) are required to increase die size while reducing defect densities.
Rudolph Technologies NSX and AXi series are designed to meet the unique challenges of LED inspection; including bare wafer inspection, unique substrate automation, high die count, sawn wafer inspection, severe die rotation, partial wafer inspection, reconstituted wafer inspection, and completed package inspection. The product line offers a single source inspection solution from incoming to finish product positioned with advanced resolutions required to detect the defects of interest at a low cost of ownership.
Productive defect detectability in multiple applications
Probe mark inspection: quality assurance for Known Good Die and die products