The MetaPULSE® G is a thin film measurement tool optimized specifically for copper damascene processes at 32nm through 22nm technology nodes, and surface finish/RDL metrology in new 3D applications.
This new metrology system is the latest addition to Rudolph's MetaPULSE line -- the industry standard for thickness measurements on opaque films. The MetaPULSE G delivers superior performance on copper films that are critical in advanced device technologies and new TSV processes. Unlike optical and x-ray techniques, it measures film thickness using a time-resolved acoustic signal that can be used in active die in the absence of special underlying test pads.
- Measure up to 60 WPH with gauge-capable precision and reduced CoO
- High-reliability, green wavelength ultra-fast laser is optimized for copper applications, delivering higher signal-to-noise ratios and superb measurement repeatability
- <10x10 micron spot size assures measurement capability on product wafers in 30x30 micron or smaller test sites
- Fabwide metal metrology with low CoO