Defect Inspection

With over 20 years of experience in defect inspection, microelectronics manufacturers around the world partner with us to improve yield by performing high-speed, automated inspection and then transforming the defect data into actionable process control with powerful analytical software.

Onto Innovation Defect Inspection Products

Firefly G3 System

Sub-micron automatic defect inspection for advanced IC substrates and panel level packaging

Firefly G3 System

Dragonfly G3 System

Automated high speed sub-micron 2D inspection and combo 3D inspection/metrology for inline process control of pattern defects and next generation technologies for advanced packaging, specialty and OQA

Dragonfly G3 System

NovusEdge G2 System

Unpatterned edge, notch and backside inspection

NovusEdge G2 System

F30 System

Advanced macro inspection for front-end manufacturers

F30 System

EB40 Module

Edge and backside inspection

EB40 Module

NSX 330 System

2D automated defect inspection and sample 3D inspection for advanced packaging

NSX 330 System

Inspection Tool Productivity Software

Software solutions to increase the value of data available from your inspection tool

Downloads & Links

Solutions

Link

Selected Papers and Articles

Photoresist Residue Detection in Advanced Packaging

White Paper for IMAPS 50th International Symposium on Microelectronics 2017

Reveal Previously Invisible Defects and Contaminants in Advanced Packaging Applications

Article for Solid State Technology

Total Control of the Bump Process to Ensure Reliability of Stacked Devices

Article for Chip Scale Review

News & Events

Rudolph Technologies Expands Memory Customer Base with $21 Million in System Orders

Jan 15, 2018 // Company News

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