Newsroom

April 27, 2015

Rudolph Wins Lithography and Inspection Orders for Fan-out Wafer Level Packaging Applications

The JetStep System boasts new productivity improvements and lower cost-of-ownership

Flanders, New Jersey (April 27, 2015)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a major outsourced assembly and test (OSAT) manufacturer has placed a $12 million order for a follow-on JetStep® Advanced Packaging Lithography System and multiple NSX® Inspection Systems for use in their planned capacity expansion. The tools, which will ship this quarter and next, will be used in high-performance fan-out wafer level packaging (FOWLP) applications.

“The JetStep System will be equipped with new hardware and software features that significantly increases our industry-best productivity. These upgrades will also be applied to the existing installed base, providing our customer with a significant capacity increase at a best-in-class cost-of-ownership," said Rich Rogoff, vice president and general manager of Rudolph’s Lithography Systems Group. "The JetStep System continues to be the clear choice for advanced packaging fan-out wafer level processes due to its ability to handle warped wafers with varying die placement.”

“In addition to lithography, we are pleased to supply the latest 2D and 3D inspection and metrology solutions for the same FOWLP applications,” added Mike Goodrich, vice president and general manager of the Rudolph’s Inspection Business Unit. “Our newest NSX Systems offer the fast, reliable inspection and metrology needed for demanding advanced packaging applications, such as photoresist thickness and redistribution layer (RDL) and under bump metallization (UBM) height measurements.”

Further enhancing both the JetStep System and the NSX Systems is Rudolph’s Discover® Yield Management Software, which enables yield improvement through real-time analysis for faster solutions, increasing the productivity of each tool and the overall fab yield.

The JetStep Advanced Packaging Lithography Systems have been specifically designed to meet the challenges of back-end manufacturing. The systems address the needs of both the existing flip chip processes (bump and copper pillar), as well as emerging processes, such as fan-out wafer level packaging, interposers and 3D approaches. The JetStep system is unique in its ability to not only handle standard wafers, but also a wide range of substrates and sizes with significant process-induced warp, while being capable to print fine features for large packages such as interposers in a single shot. With these capabilities, the system provides the flexibility to meet the diverse manufacturing requirements of advanced packaging with superior throughput when compared to legacy lithography tools initially designed for the front-end, wafer-based processes.

The NSX family is the market leader for automated macro defect inspection for advanced packaging. The NSX system is a single solution that combines 2D inspection with 3D metrology. Discover software is Rudolph’s inline defect and metrology analysis and data management system.

For more information about Rudolph’s systems and software, please visit http://www.rudolphtech.com

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About Rudolph Technologies
Rudolph Technologies, Inc. is a leader in the design, development, manufacture and support of defect inspection, advanced packaging lithography, process control metrology, and data analysis systems and software used by semiconductor device manufacturers worldwide. Rudolph provides a full-fab solution through its families of proprietary products that provide critical yield-enhancing information, enabling microelectronic device manufacturers to drive down the costs and time to market of their products. The Company’s expanding portfolio of equipment and software solutions is used in both the wafer processing and final manufacturing of ICs, and in adjacent markets such as FPD, LED and Solar. Headquartered in Flanders, New Jersey, Rudolph supports its customers with a worldwide sales and service organization. Additional information can be found on the Company’s website at http://www.rudolphtech.com

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Safe Harbor Statement
This press release contains forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995 (the “Act”) which include the benefits to customers of Rudolph’s products, Rudolph’s business momentum and future growth, Rudolph’s existing market position and its ability to maintain and advance such position relative to its competitors and Rudolph’s ability to meet the expectations and needs of our customers as well as other matters that are not purely historical data. Rudolph wishes to take advantage of the “safe harbor” provided for by the Act and cautions that actual results may differ materially from those projected as a result of various factors, including risks and uncertainties, many of which are beyond Rudolph’s control. Such factors include, but are not limited to, delays in shipping products for technical performance, component supply or other reasons, the company’s ability to leverage its resources to improve its positions in its core markets and fluctuations in customer capital spending. Additional information and considerations regarding the risks faced by Rudolph are available in Rudolph’s Form 10-K report for the year ended December 31, 2014 and other filings with the Securities and Exchange Commission.  As the forward-looking statements are based on Rudolph’s current expectations, the company cannot guarantee any related future results, levels of activity, performance or achievements. Rudolph does not assume any obligation to update the forward-looking information contained in this press release.

Contacts:

Investors:    
Steven R. Roth   
973.448.4302    
steven.roth@rudolphtech.com

Guerrant Associates
Laura Guerrant-Oiye
Principal
808.882.1467
lguerrant@guerrantir.com 

Trade Press:
Amy Shay
952.259.1794
amy.shay@rudolphtech.com