Newsroom

Yield Forum Singapore

A Technology and Applications Forum presented by Rudolph Technologies

31 July 2014
Ramada Singapore at Zhongshan Park
16 Ah Hood Rd, Singapore 329982

Featuring guest speakers from local fabs, the Rudolph Yield Forum™ provides process engineers, fab managers and tool owners with new application data and process control techniques that address current process challenges. Experts will speak to current trends and applications for macro defect inspection, 3DIC inspection and metrology, thin film metrology, advanced packaging lithography, yield management and process control techniques

Agenda Highlights

Wafer Processing (Front-end) Session
Bulk Acoustic Metrology and Defect Inspection for Metal Structures
TSV Middle Inspection and Metrology
Fleet Management: Optimizing your Rudolph Inspection Systems
Intro to SEM ADC
Supply Chain Value
Bare Wafer Inspection
Metrology Challenges and Techniques for Gate Oxide Control at 1x and 2x Nodes
MEOL Lithography

Final Manufacturing (Back-end) Session
Monitoring Process Tool Particles & Edge Trip Defects using Darkfield Laser Scattering Technology
TSV and Cu Pillar Bump Process Control Metrology
Lithography Challenges for 2.5D Interposers and Related Processes
3D Measurement for TSV, MEOL, RST and Temporary Bonding
Fleet Management: Optimizing your Rudolph Inspection Systems
OSAT 2.5D/3D Model for Transparent and Metal Film Metrology
Closed Loop Total Solution for Advanced Packaging Lithography
Trends in Cu Pillar Bump Metrology and Yield Improvement Strategies
A Comprehensive Solution for Post-saw Delamination including Reduced Review

*Agenda subject to change. Check back for updated agenda.

For More Information:
Contact: Winn Soo, Rudolph Singapore
Email: winn.soo@rudolphtech.com
Tel: +65 (6) 749 6988