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Semicon China

March 14 - 16, 2018

Shanghai New International Expo Center
Shanghai, China

Booth 2655 | Hall N2

Rudolph is excited to join Semicon China in 2018! Find us in hall N2, booth 2655 to talk with one of our experts regarding your application needs.

Providing inspection and metrology process control solutions to both front-end wafer processors and back-end final manufacturers, Rudolph systems and software help our customers transform data into actions that reduce cost and improve yields. In addition to process control solutions, we will be highlighting our JetStep advanced packaging lithography stepper to help OSATS achieve high cost of ownership with a flexible lithography system for multiple advanced packaging applications.