Newsroom

January 6, 2016

Rudolph Technologies to Present at 18th Annual Needham Growth Conference

January 11, 2016

Rudolph Technologies Schedules 2015 Fourth Quarter and Full Year Financial Results Conference Call for February 1, 2016

February 1, 2016

Rudolph JetStep Lithography System Selected for First Panel Fan-out Packaging Manufacturing Line

Rudolph is positioned to capture the early adopters of the emerging advanced packaging panel lithography market

February 1, 2016

Rudolph Technologies Reports 2015 Fourth Quarter and Year-End Results

• Advanced Packaging Drives Record Sales Year;
• Lithography Business Unit Completes Third Consecutive Year of Growth

February 3, 2016

Rudolph Announces Win in Patent Infringement Lawsuit against Camtek

Judgment rendered in first of three patent infringement lawsuits

March 23, 2016

Veeco Receives Order for New Predictive Analytics Platform Featuring Rudolph Software

New Predictive Analytics Platform Lowers Customer Maintenance Costs and Improves Equipment Uptime

April 5, 2016

Rudolph to Host Company Sponsored Analyst Event May 9, 2016 in New York, NY

April 6, 2016

Rudolph Technologies Schedules 2016 First Quarter Financial Results Conference Call for May 2, 2016

April 7, 2016

Rudolph Adds High-speed 3D Metrology to the NSX Series for Advanced Packaging Process Control

Initial orders for new High-speed 3D Metrology NSX system, totaling $5 million, demonstrate early success

May 2, 2016

Rudolph Technologies Reports 2016 First Quarter Results

• Strong Sales of Process Control Solutions Drive Increase in Results to High-End of Guidance

May 9, 2016

Rudolph Technologies Appoints Debbora Ahlgren as Vice President of Global Customer Operations

May 12, 2016

Rudolph Technologies to Present at Second Quarter 2016 Investor Conferences

June 24, 2016

Rudolph Technologies to Participate in the Eighth Annual CEO Investor Summit 2016

Accredited investor and publishing research analyst event to be held concurrently with SEMICON West and Intersolar 2016 in San Francisco.

June 28, 2016

Rudolph Receives Multi-System Order for Over $11 Million From a Leading OSAT for Fan-out Wafer Level Packing Inspection

Rudolph Inspection, Metrology and Analysis selected for large-scale ramp of Fan-out Wafer Level Package Production (FOWLP).

June 30, 2016

Rudolph Technologies Schedules 2016 Second Quarter Financial Results Conference Call for July 28, 2016

RTEC Q2 2016 Earnings Call Notification

July 11, 2016

Rudolph Technologies Announces New Clearfind Technology for Advanced Packaging Inspection

Clearfind technology sees organic defects that often escape detection with conventional white-light inspection technologies

July 15, 2016

Rudolph Redeems $60 Million in Convertible Notes

Rudolph Technologies Redeems Convertible Notes

July 28, 2016

Rudolph Technologies Reports 2016 Second Quarter Results

• Strong Lithography Sales Drive Record Quarterly Revenue
• Earnings Exceed Guidance

September 6, 2016

Rudolph Technologies Unveils New Inspection Suite for Front- and Back-end Semiconductor Manufacturing

Rudolph continues to drive the technological innovation of its inspection and metrology products to deliver solutions that address the demanding needs across front- and back-end processes

September 13, 2016

Rudolph Technologies to Present at the Dougherty & Co. Institutional Investor Conference on September 28

October 6, 2016

Rudolph Technologies Schedules 2016 Third Quarter Financial Results Conference Call for November 7, 2016

November 7, 2016

Rudolph Technologies Reports 2016 Third Quarter Results

• Process Control Equipment Sales Drive Year-over-Year Growth;
• First Semi Panel Lithography System Ships in the Quarter

November 22, 2016

Rudolph Technologies to Participate in the Fifth Annual Midtown Cap Investor Summit 2016

December 22, 2016

Rudolph Announces Ruling in Patent Reexamination Appeal by Camtek

Opinion rendered which confirmed validity of additional patent claims