Newsroom

January 4, 2013

Rudolph to Participate in Two Investor Events in January 2013

• Hosts Company Sponsored Analyst Event Jan. 14, 2013 (New York, NY)
• Participates in 15th Annual Needham Growth Conference Jan. 16, 2013 (New York, NY)

January 17, 2013

Rudolph Technologies Schedules 2012 Fourth Quarter Earnings Conference Call for February 4, 2013

February 4, 2013

Rudolph Technologies Reports Record 2012 Year End Results

Record Revenue of $218 Million for 2012 Driven by Major Foundry and Outsourced Assembly and Test Customers; Fourth Quarter Revenue of $54.3 Million Up 25 Percent Year-Over-Year

February 11, 2013

Rudolph’s Discover Yield Management Software Gains Traction in Advanced Packaging Applications

Back-end manufacturers adopt front-end strategies to maximize yields with analysis of inspection and metrology data

February 25, 2013

Rudolph to Participate in UBS SMID Cap One-on-One Symposium

April 10, 2013

Rudolph Technologies Schedules 2013 First Quarter Earnings Conference Call for May 2, 2013

April 29, 2013

Rudolph Purchases Selected Assets from Tamar Technology; Adds 3D Measurement Capability for Advanced Packaging Applications

Tamar’s unique and established technologies deliver critical process control metrology for flip-chip copper pillar bumping and other emerging applications

May 2, 2013

Rudolph Technologies Reports 2013 First Quarter Results

Customer Acceptance of First JetStep System Results in Initial Lithography Revenue Recorded in First Quarter; Market Share Gains in Macro Defect Inspection Drive Forward Momentum and Second Quarter Revenue Guidance Growth

May 2, 2013

Rudolph Receives Customer Acceptance of First JetStep System for Advanced Packaging Applications

• Validates commercialization of revolutionary 2X stepper total lithography solution
• Flexible substrate handling and large exposure field provide critical benefits in wafer level packaging process

May 2, 2013

Rudolph Technologies Launches S3000SX Transparent Thin Film Metrology System for 28nm Node and Below

New S3000SX System in a modular architecture with small site measurement capability offers flexibility and cost of ownership advantage for advanced process nodes

May 28, 2013

Rudolph to Participate in Two Investor Conferences

• DA Davidson 5th Annual Technology Forum
• Credit Suisse Semiconductor Supply Chain Conference

June 21, 2013

Rudolph to Participate in the Fifth Annual CEO Investor Summit 2013

Accredited investor and publishing research analyst event to be held concurrently with SEMICON West and Intersolar 2013 in San Francisco

June 24, 2013

Rudolph Announces the JetStep Panel Lithography System for Advanced Packaging

Unique stepper design is driven by the semiconductor advanced packaging transition from wafer to panel manufacturing

July 16, 2013

Rudolph Technologies Schedules 2013 Second Quarter Earnings Conference Call for August 1, 2013

July 24, 2013

Rudolph Announces New Metrology Suite for Advanced Packaging

New NSX Metrology Series includes application-specific configurations to address unique metrology requirements for wafer level packaging, 2.5D and 3DIC

August 1, 2013

Rudolph Technologies Reports 2013 Second Quarter Results

Revenue Increased 11 Percent Sequentially, Fueled by a Balance of Front-End Metrology and Back-End Macro Defect Inspection Business

September 3, 2013

Rudolph Adds NSX 220 System to Macro Defect Inspection Family

The new NSX tool is designed for semiconductor, MEMS and LED packaging and test facilities to achieve productivity at a low price point

September 16, 2013

Rudolph to Participate in the Credit Suisse 4th Annual Small & Mid Cap Conference

October 9, 2013

Rudolph Technologies Schedules 2013 Third Quarter Earnings Conference Call for November 4, 2013

November 4, 2013

Rudolph Technologies Reports 2013 Third Quarter Results

Strong Profit Performance: Non GAAP Earnings Per Share of $0.06
Front-End Logic, Foundry and Memory Orders Increase

November 4, 2013

Ruling Issued in Rudolph’s Patent Infringement Case Brought by ITC

Judgement reversed at least $23.4 million in damages.

November 18, 2013

Rudolph Technologies to Participate in the Second Annual Midtown Cap Investor Summit 2013

November 19, 2013

Rudolph Technologies’ Management System Earns ISO 9001:2008 Certification

November 21, 2013

Rudolph Wins Multiple Orders for AWX Unpatterned Wafer Inspection Tools in Back-End and Advanced Packaging Applications

AWX system combines the sensitivity, speed and data analysis needed to optimize back-end processes and minimize cost

December 3, 2013

Rudolph Technologies to Transfer Stock Listing to NYSE

December 19, 2013

Rudolph to Host Company Sponsored Analyst Event January 13, 2014 (New York, NY)