Newsroom

January 11, 2010

Rudolph Technologies Receives Multiple System Orders from STATS ChipPAC for eWLB Inspection

Thin, warped wafer handling using NSX 2D inspection system and Wafer Scanner™ 3D bump inspection system seen as key enabler for eWLB high-volume production

January 19, 2010

Rudolph Technologies Schedules 2009 Fourth Quarter Earnings Conference Call for February 1, 2010

February 1, 2010

Rudolph Technologies Fourth Quarter 2009 Financial Results Exceed Guidance; Record Bookings Lay Foundation for Robust 2010

February 16, 2010

Rudolph Technologies Receives $5 Million in Capacity Orders for Metrology Production Tools from Tier One Memory Manufacturer

Stability and tool-to-tool matching key factors in selection of Rudolph’s S3000A transparent metrology systems for gate oxide dielectric process

March 15, 2010

Rudolph Technologies Selects Distribution Partner for Probe Card Test and Analysis Products in Europe

New distributor, John P. Kummer, enhances sales and support for probe analysis products in critical European markets

April 12, 2010

Rudolph Announces Multilpe Software Orders from Japan

Chip manufacturers use Discover Enterprise Software to improve yield and profitability across a range of applications.

April 19, 2010

Rudolph Technologies Schedules 2010 First Quarter Earnings Conference Call for April 29, 2010

April 28, 2010

Rudolph Technologies to Hold May 11 Technology Forum in Taiwan

April 29, 2010

Rudolph Technologies First Quarter 2010 Financial Results Exceed Guidance

Fourth Consecutive Quarter with Double-Digit Revenue Growth

June 7, 2010

Rudolph Adds Direct-Dock Probe Card Capability to PrecisionWoRx VX4

Industry standard VX platform expanded to handle larger, heavier assemblies required for faster testers.

June 8, 2010

Rudolph Technologies to Present at the UBS Global Technology and Services Conference

July 12, 2010

Fraunhofer ISIT Selects Rudolph Technologies for MEMS Inspection

Rudolph advanced macro inspection system to be used for developing processes for high-volume manufacturing and packaging of inertial MEMS on wafer level

July 29, 2010

Court Confirms Verdict in Favor of Rudolph

Permanent Injunction Against Camtek Upheld

August 2, 2010

Rudolph Technologies Reports Sequential Quarterly Increases of 19 Percent Revenue and 218 Percent Earnings for the Second Quarter 2010

Strong front-end metrology and inspection orders drove book-to-bill well in excess of industry average

August 11, 2010

Rudolph Technologies Acquires Selected Assets Related to MKS Instruments’ Yield Dynamics Software Business

Products and R&D Capability Complement Rudolph’s Expanding Presence in Semiconductor Process Control

September 7, 2010

Rudolph Technologies Announces Multi-System Order for PrecisionWoRx VX4

September 7, 2010

Rudolph Technologies Appoints STAr Technologies as Authorized Vendor for Probe Card Interfaces in Asia

Appointment provides customers in region with a cost-effective, local supplier for probe card interfaces

September 7, 2010

Rudolph Technologies, Inc. Announces Upcoming Investor Conference Participation

October 12, 2010

Rudolph Technologies Schedules 2010 Third Quarter Earnings Conference Call for November 1, 2010

4:45 pm ET

October 19, 2010

Rudolph Technologies Appoints Avishai Kepten as Vice President and General Manager

November 1, 2010

Rudolph Technologies Reports 124 Percent Increase in Revenue and Exceeds Earnings Guidance for the Third Quarter 2010

Strong front-end and software sales drive gross margin to historical high of 56 percent

November 30, 2010

Rudolph Technologies Collaborates with Asia OSAT on Development and Characterization of Stacked Packaging Process

Rudolph to provide 2D defect inspection, 3D solder bump and TSV depth metrology as well as data analysis and trending software to major OSAT in Asia