January 18, 2007

Rudolph Reaches Milestone with 50th AXi System Installation at Korean Memory Manufacturer

January 22, 2007

Rudolph Appoints Yasuomi Uchida, Chairman, and Yoshiro Ogaya, President, of Rudolph Technologies Japan KK

February 7, 2007

Rudolph Technologies Announces Record 2006 Quarterly Earnings In Line With Guidance

February 22, 2007

Rudolph Continues Leadership in Automotive IC Inspection with Order from austriamicrosystems

European analog integrated circuits provider places order for both front- and back-end inspection solutions.

April 4, 2007

Rudolph Technologies Schedules First Quarter 2007 Earnings Conference Call for May 7, 2007

May 7, 2007

Rudolph Technologies Announces First Quarter 2007 Revenue and Earnings In Line With Guidance

June 12, 2007

New Rudolph NSX 100 Lowers Inspection Cost in Critical Final Manufacturing Processes

June 14, 2007

Rudolph Receives Multiple System Order for NSX 105 Automated Macro Defect Inspection Tool

July 16, 2007

Rudolph Technologies Announces New Discover Data Analysis Software

New software enhances return on inspection and metrology investments and speeds time-to-yield learning

July 16, 2007

Rudolph’s New Explorer Family Brings Cluster Architecture to Multi-surface Inspection Tools

Adaptive wafer scheduling, flexible configuration and high throughput reduce cost-of-ownership

July 16, 2007

Rudolph’s New MetaPULSE IIIa System Offers Higher Throughput and Lower CoO for DRAM Metrology Applications

Multiple Orders Already Received from Taiwanese DRAM Fabs

July 23, 2007

Rudolph Technologies Schedules Second Quarter 2007 Earnings Conference Call for August 6, 2007

August 6, 2007

Rudolph Technologies Announces Second Quarter 2007 Revenue and Earnings in Line With Guidance

August 14, 2007

European Fab Installs Second Rudolph Inspection System to Meet 100-Percent Inspection Requirements of Automotive Industry

Fast, automated NSX tools become de facto standard

September 4, 2007

Rudolph Technologies Delivers Edge Inspection Tool to ASML Holding NV

Equipment will focus on the impact of wafer edge process control

September 10, 2007

Rudolph Showcases AXi 935 Advanced Macro Defect Inspection System at SEMICON Taiwan 2007

Taiwan foundry selects Rudolph AXi for Copper CMP

September 17, 2007

Rudolph’s DMSVision Software Improves Yield in Advanced 300mm Memory Fabs

Fab-wide Data Management System—a Platform for Higher Yields

October 1, 2007

Japan Fab Purchases Rudolph AXi System for Inspection of Automotive Devices

Macro inspection edges into space previously occupied by high-cost micro tools

October 2, 2007

Rudolph Technologies Schedules Third Quarter 2007 Earnings Conference Call for November 1, 2007

October 15, 2007

Rudolph Technologies Announces Milestone Shipments of TrueADC Software for Automatic Defect Classification

Installed base exceeds 30 systems; 18 shipped in most recent quarter

November 1, 2007

Rudolph Technologies Announces Third Quarter 2007 Earnings Above Guidance and Revenue at Top End of Guidance Range

November 7, 2007

Rudolph To Ship Multiple Transparent Film Metrology Tools to Taiwan Memory Foundry

New, production-worthy S3000A System moves quickly into marketplace

November 14, 2007

Rudolph Ships 100th Wafer Edge and Backside Inspection System

An increasing number of fabs recognize value of all-surface inspection

November 27, 2007

Rudolph Technologies and Entrepix, Inc. Announce License Agreement

Entrepix to market Rudolph AutoEL Series Ellipsometer

December 18, 2007

Rudolph Technologies Acquires Semiconductor Business of Applied Precision, LLC

Wafer probe card test and analysis added to Rudolph’s portfolio

December 18, 2007

Rudolph Technologies Schedules Call to Discuss Details of the Acquisition of Applied Precision’s Semiconductor Division