May 2, 2013
Rudolph Technologies Launches S3000SX Transparent Thin Film Metrology System for 28nm Node and Below
New S3000SX System in a modular architecture with small site measurement capability offers flexibility and cost of ownership advantage for advanced process nodes
May 2, 2013
Rudolph Receives Customer Acceptance of First JetStep System for Advanced Packaging Applications
• Validates commercialization of revolutionary 2X stepper total lithography solution
• Flexible substrate handling and large exposure field provide critical benefits in wafer level packaging process
April 29, 2013
Rudolph Purchases Selected Assets from Tamar Technology; Adds 3D Measurement Capability for Advanced Packaging Applications
Tamar’s unique and established technologies deliver critical process control metrology for flip-chip copper pillar bumping and other emerging applications
February 25, 2013
Rudolph to Participate in UBS SMID Cap One-on-One Symposium
January 4, 2013
Rudolph to Participate in Two Investor Events in January 2013
• Hosts Company Sponsored Analyst Event Jan. 14, 2013 (New York, NY)
• Participates in 15th Annual Needham Growth Conference Jan. 16, 2013 (New York, NY)
December 12, 2012
Rudolph Enters Back-end Lithography Market with Breakthrough Total Solution for Advanced Packaging
Rudolph Acquires Azores Corp. and Unveils JetStep—A Revolutionary 2X Reduction Stepper Total Lithography System
November 26, 2012
Rudolph Technologies to Participate in Two Investor Conferences
- Credit Suisse Annual Technology Conference (Scottsdale, AZ)
- Midtown CAP Summit (New York, NY)
August 28, 2012
Rudolph Technologies to Participate in Investor Conferences
June 21, 2012
Rudolph Acquires NanoPhotonics; Adds New Technologies to Enhance Position in High-Growth Advanced Packaging Market
Advanced edge and backside wafer inspection technologies are in growing demand to meet emerging wafer fab and advanced packaging process requirements
