May 2, 2013
Rudolph Technologies Launches S3000SX Transparent Thin Film Metrology System for 28nm Node and Below
New S3000SX System in a modular architecture with small site measurement capability offers flexibility and cost of ownership advantage for advanced process nodes
May 2, 2013
Rudolph Receives Customer Acceptance of First JetStep System for Advanced Packaging Applications
• Validates commercialization of revolutionary 2X stepper total lithography solution
• Flexible substrate handling and large exposure field provide critical benefits in wafer level packaging process
May 2, 2013
Rudolph Technologies Reports 2013 First Quarter Results
Customer Acceptance of First JetStep System Results in Initial Lithography Revenue Recorded in First Quarter; Market Share Gains in Macro Defect Inspection Drive Forward Momentum and Second Quarter Revenue Guidance Growth
